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KuhlTherm Raises $1.1 Million Seed Round Led by Arkam Ventures

KuhlTherm develops precision liquid cooling technologies designed for AI-driven data centres and HPC environments.

Sushree Sohini SahuSushree Sohini SahuJuly 18, 2026
KuhlTherm Raises $1.1 Million Seed Round Led by Arkam Ventures

Deeptech startup KuhlTherm has raised $1.1 million (around ₹10 crore) in a seed funding round led by Arkam Ventures to accelerate the development of its liquid cooling technologies for AI data centres and high-performance computing (HPC) infrastructure.

The fresh capital will be used to strengthen product development, expand research and testing infrastructure, grow the company’s engineering and business development teams, secure industry certifications, and build strategic partnerships as it scales its commercial operations.

Founded in 2025 by Shailesh Bishnoi, Vishant Gandhi, Kamish Kachhadia, Jasvipul Chawla, and Kishan Baravaliya, Ahmedabad-based KuhlTherm develops precision liquid cooling technologies designed for AI-driven data centres and HPC environments. The founding team brings expertise in thermal engineering, advanced manufacturing, and infrastructure technologies.

Its product portfolio includes Direct-to-Chip cooling systems, Rear Door Heat Exchangers (RDHx), immersion cooling solutions, Coolant Distribution Units (CDUs), and NexusFlow OS, a proprietary software platform for intelligent thermal management, infrastructure monitoring, and cooling optimisation.

The company’s solutions are designed to support increasingly power-intensive AI workloads by reducing cooling energy consumption while improving the efficiency and sustainability of data centre operations. By combining proprietary cooling hardware with software-driven monitoring and analytics, KuhlTherm offers modular, retrofit-ready systems that can be deployed in both existing facilities and new AI infrastructure projects.

Its Direct-to-Chip cold plates utilise patented mesh-based cooling technology to efficiently dissipate heat generated by high-performance processors, while its modular Rear Door Heat Exchanger architecture enables operators to increase cooling capacity as rack power densities continue to rise. Through NexusFlow OS, data centre operators can monitor thermal performance in real time, optimise coolant flow, and improve infrastructure reliability and operational efficiency.